The Dasenic Electronics Blog
Comprehensively understand everything about electronic components at Dasenic.
- Advanced Packaging and Chiplet: A New Era in Semiconductor Design
Today, semiconductor giants can use advanced packaging technology to produce CPU or GPU multi-die components with excellent density, energy efficiency and performance. However, the real potential of chiplets is to democratize the design of complex silicon systems.
Jan 06,2025 185 - A Review of Wide Bandgap Semiconductor Technology
The most important of these products, such as silicon carbide (SiC) and gallium nitride (GaN), are revolutionizing the world of electronics with their superior properties over traditional silicon-based semiconductors.
Dec 19,2024 222 - The bright new star of the fourth generation of semiconductor materials - gallium oxide
Gallium oxide (Ga₂O₃) has been hailed as the "bright new star" of the next generation of semiconductor materials in recent years, and has attracted much attention due to its unique physical properties and wide application potential.
Dec 16,2024 268 - SiC, Chiplet, RISC-V: Three major innovative forces in the development of automotive semiconductors
Although the automotive market has slowed down and the forecast for automotive semiconductors has been revised downward, these new technologies will still improve the performance of automotive semiconductors and bring about technological changes...
Dec 13,2024 271 - US CHIPS Act 2024 in-depth implementation: How to reshape the global semiconductor supply chain and the future of technology
In August 2024, as the CHIPS Act is further promoted, the United States strives to localize the semiconductor industry and reduce external dependence. This strategic transformation is reshaping the global chip supply chain and is crucial to the future development of emerging technology fields such as AI and big data. This article deeply analyzes how the CHIPS Act reshapes the global supply chain and brings key industry impacts.
Nov 12,2024 219 - Nordic Semiconductor NRF52832-QFAA-R
NRF52832-QFAA-R is a wireless communication chip with excellent performance, low power consumption and easy development. It supports the new features of Bluetooth 5.0, making it widely used in the fields of IoT, smart homes and portable devices. Its powerful computing power and multi-protocol support provide developers with flexible solutions.
Sep 23,2024 435 - What impact will Trump's second term have on the semiconductor industry
With the 2024 US presidential election, Trump won. So, what impact will he have on the semiconductor and even the technology industry after he takes office?
Aug 20,2024 339 - Earthquake Impacts Semiconductor Manufacturers in Taiwan
As a key stakeholder in global semiconductor production, this event will impact the electronic component supply chain, but the extent is still being assessed.
Apr 09,2024 257